A high-precision conductive component that connects testing equipment to chip lead (or pads) through physical contact, transmitting electrical signals between the tester (e.g., probe stations, test machines) and the chip to ensure accurate functional testing.

Burn-in socket is a specialized device used for aging tests, which can effectively simulate complex environmental conditions to replicate the aging effects that chips would experience during actual use.

1. Mainly used in the CP testing process, connecting the motherboard of the Tester and the Probe Card;

2. Contains precisely arranged spring probes with excellent mechanical and electronic characteristics;

It is a product made from metal raw materials through micro-stamping technology or other composite technologies. It is an important electronic component, mainly serving to protect and fix the internal electronic parts.

Wafer testing probes used in vertical probe cards are divided into two categories: MEMS probes and spring probes. Among them, MEMS probes have extremely fine diameters, featuring high consistency and stability. MEMS processes can fabricate metal microstructures with tiny diameters, meeting testing requirements such as fine pitch, elastic testing range, high pin count, and high density. Spring probes, meanwhile, are mostly used in WLCSP testing, offering advantages like low cost and convenient maintenance.

High-current test socket is a testing interface component specially designed for high-current scenarios such as power semiconductors and power management chips. It adopts Blade contacts, and its core function is to stably transmit high currents during testing while ensuring low-loss electrical connections and thermal stability.

Manual test LID is a component of a chip test socket, typically used for manually operated chip testing. Its function is to apply appropriate pressure to the chip through manual operation, securing the chip in the precise position to ensure optimal contact between the chip pins and the socket's probes or spring contacts. This prevents any displacement of the chip during testing, which could compromise the accuracy of the test results. Some LID are equipped with heatsinks that can help dissipate heat from the chip.

Open top structure is a burn-in pin  customizable  structure for semiconductor chip reliability testing, which has the characteristics of customizability, high reliability and low cost.

Clamshell structure is a burn-in pin  customizable  structure for semiconductor chip reliability testing, which has the characteristics of customizability, high reliability and low cost.

The customizable vacuum pogo tower uses vacuum suction to secure the tester‘s motherboard and probe card, making it stable and reliable.

Coaxial pogo tower, the signal channel uses a coaxial structure, with controllable impedance, capable of transmitting high frequencies.

Stiffener is an essential component of the probe card, mainly used to enhance the mechanical stability of the probe card. By increasing the rigidity of the probe card, it prevents the probe card from bending during use, which could cause the probe to fail to precisely contact the solder pads or bumps on the chip, thereby affecting the accuracy of the test.

Stiffener is an essential component of the probe card, mainly used to enhance the mechanical stability of the probe card. By increasing the rigidity of the probe card, it prevents the probe card from bending during use, which could cause the probe to fail to precisely contact the solder pads or bumps on the chip, thereby affecting the accuracy of the test.

Stiffener is an essential component of the probe card, mainly used to enhance the mechanical stability of the probe card. By increasing the rigidity of the probe card, it prevents the probe card from bending during use, which could cause the probe to fail to precisely contact the solder pads or bumps on the chip, thereby affecting the accuracy of the test.

The Burn-in Jig plays a crucial role in the manufacturing process of electronic products. By simulating various stress conditions that the products may encounter in actual use, such as temperature, humidity, electrical signals, etc., the tests can accelerate the exposure of potential defects, thereby screening out faulty components at an early stage before the products are released. It's very import for improving the reliability and stability of the products.